An improved correlation for void fraction during in-tube condensation

Cong Guo, Tao Wang*, Yuyan Jiang, Chaohong Guo, Miao Zeng, Dong Yu, Dawei Tang

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

A comprehensive literature research was undertaken for the available void fraction correlations and experimental void fraction data during condensation inside tubes. Comparisons between the correlations showed that slip ratio models were probably more suitable for the determination of void fraction at low mass velocity when the slip ratio was chosen appropriately. For high mass velocity, there was no apparent difference for the predictions of various models. In addition, the Froude rate parameter (dimensionless number) can be used for representing the flow characteristics during condensation inside tube and was defined in terms of mass flux and quality. Based on the observations made, a new correlation was developed through the weighted average method without resorting back to very complex expressions. This correlation was a simple model and obtained involving with the Froude rate parameter and slip ratio models. The improved correlation has been shown to be in good agreement with data ranging from low mass velocity up to very high mass velocity.

源语言英语
主期刊名ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
出版商American Society of Mechanical Engineers
ISBN(电子版)9780791856871
DOI
出版状态已出版 - 2015
已对外发布
活动ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, 美国
期限: 6 7月 20159 7月 2015

出版系列

姓名ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

会议

会议ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
国家/地区美国
San Francisco
时期6/07/159/07/15

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