Alloying regulation mechanism toward microstructure evolution of Sn-bi-based solder joint under current stress

Zhuangzhuang Hou, Xiuchen Zhao*, Yong Wang, Yue Gu, Chengwen Tan, Xiaochen Xie, Yongjun Huo, Ying Liu

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

13 引用 (Scopus)

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Engineering

Material Science