Advanced Electronic Packaging Technology: From Hard to Soft

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@article{5540204894d746399b49e0c5ea645ef5,

title = "Advanced Electronic Packaging Technology: From Hard to Soft",

author = "Yue Gu and Yongjun Huo",

year = "2023",

month = mar,

doi = "10.3390/ma16062346",

language = "English",

volume = "16",

journal = "Materials",

issn = "1996-1944",

publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",

number = "6",

}

TY - JOUR

T1 - Advanced Electronic Packaging Technology

T2 - From Hard to Soft

AU - Gu, Yue

AU - Huo, Yongjun

PY - 2023/3

Y1 - 2023/3

UR - http://www.scopus.com/inward/record.url?scp=85151518805&partnerID=8YFLogxK

U2 - 10.3390/ma16062346

DO - 10.3390/ma16062346

M3 - Editorial

AN - SCOPUS:85151518805

SN - 1996-1944

VL - 16

JO - Materials

JF - Materials

IS - 6

M1 - 2346

ER -