Advanced Electronic Packaging Technology: From Hard to Soft

Yue Gu; Yongjun Huo

doi:10.3390/ma16062346

Advanced Electronic Packaging Technology: From Hard to Soft

Yue Gu, Yongjun Huo^*

^*此作品的通讯作者

材料学院

科研成果: 期刊稿件 › 社论

13 引用（Scopus）

源语言	英语
文章编号	2346
期刊	Materials
卷	16
期	6
DOI	https://doi.org/10.3390/ma16062346
出版状态	已出版 - 3月 2023

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10.3390/ma16062346

其它文件与链接

链接到 Scopus 的出版物

引用此

Gu, Y., & Huo, Y. (2023). Advanced Electronic Packaging Technology: From Hard to Soft. Materials, 16(6), 文章 2346. https://doi.org/10.3390/ma16062346

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