A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators

Jicong Zhao, Quan Yuan, Wei Luo, Xiao Kan, Jinying Zhang, Jinling Yang*, Fuhua Yang

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

This paper presents a vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. Sn-rich Au-Sn solder bonding is used to achieve reliable hermetic packaging with high shear strength. An equivalent circuit model of the packaged resonator is established to analyze the parasitic effect caused by encapsulation. Reduction of the parasitic effect is achieved via grounding sealing ring, and decreasing overlap between sealing ring and VHF traces. The measured frequency spectrum of a packaged resonator was not distorted by parasitic effect, which was well consistent with the simulation result. Besides, the Q values of the resonator increase from 6600 to 10400 due to vacuum encapsulation.

源语言英语
主期刊名MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
出版商Institute of Electrical and Electronics Engineers Inc.
573-576
页数4
ISBN(电子版)9781509019731
DOI
出版状态已出版 - 26 2月 2016
已对外发布
活动29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, 中国
期限: 24 1月 201628 1月 2016

出版系列

姓名Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2016-February
ISSN(印刷版)1084-6999

会议

会议29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
国家/地区中国
Shanghai
时期24/01/1628/01/16

指纹

探究 'A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators' 的科研主题。它们共同构成独一无二的指纹。

引用此

Zhao, J., Yuan, Q., Luo, W., Kan, X., Zhang, J., Yang, J., & Yang, F. (2016). A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. 在 MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems (页码 573-576). 文章 7421690 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2016-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2016.7421690