A Process Improvement in Silver-indium Transient Liquid Phase Bonding Method for the High-Power Electronics and Photonics Packaging
Donglin Zhang, Xiuchen Zhao, Yingxia Liu, Ying Liu, Yongjun Huo
科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
4
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（Scopus）