A LTCC band pass filter for wireless applications

Bo Yuan*, Wei Hua Yu, Hou Jun Sun, Xin Lv

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

2 引用 (Scopus)

摘要

MCM (Multi-chip Module) is presently the most effective method for realizing the miniaturization of wireless front-end applications. Filter is one of the most important components in the MCM. In this paper, a novel quasi-lumped band pass filter for wireless front-end was designed and fabricated, adopting low-temperature cofired ceramics (LTCC). The BPF circuit is based on the quasi-lumped filter topology and a wideband circuit design method was adopted. The BPF has been simulated and optimized by Ansoft HFSS. The measured results which were tested not only in the normal atmospheric temperature but also in the high and low temperature agree very well with the full-wave electromagnetic designed responses The proposed filter has been realized in a ten layers ceramic substrate, showing promising application potentials in miniaturized wireless front-end.

源语言英语
主期刊名Proceedings - 2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009
470-472
页数3
DOI
出版状态已出版 - 2009
活动2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009 - Beijing, 中国
期限: 27 10月 200929 10月 2009

出版系列

姓名Proceedings - 2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009

会议

会议2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009
国家/地区中国
Beijing
时期27/10/0929/10/09

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