A Low-Temperature Ag-Ag Direct Bonding Technology Towards Ten-Thousand-Level Microbumps Arrays Utilizing Plasma-Induced Grown Nanoparticles of Silver Oxide

Taiyu Wang, Xiaochen Xie*, Songzhao Gu, Sichen Liu, Shuang Zhao, Wenxuan Gao, Pengrong Lin, Shimeng Xu, Zhibo Qu, Yong Wang, Xiuchen Zhao, Yongjun Huo*

*此作品的通讯作者

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

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Material Science

Engineering