A Laser Assisted Bonding Process Design with Silver-indium Transient Liquid Phase Method for the Infrared Detectors Hermetic Packaging

Engineering

• Transients 100%
• Liquid Phase 100%
• Bonding Process 100%
• Process Design 100%
• Active Material 33%
• Laser Heating 33%
• Active Device 33%
• Stress Level 16%
• Finite Element Method 16%
• Research Work 16%
• Thermal Stress 16%
• Term Stability 16%
• Mechanical Stress 16%
• Mechanical Damage 16%
• Heating Energy 16%
• Coefficient of Thermal Expansion 16%
• Infrared Sensor 16%
• Thermal Impact 16%

Material Science

• Indium 100%
• Silver 100%
• Finite Element Method 50%
• Thermal Stress 50%
• Thermal Expansion 50%
• Mechanical Stress 50%