A high-entropy alloy as very low melting point solder for advanced electronic packaging

Y. Liu; L. Pu; Y. Yang; Q. He; Z. Zhou; C. Tan; X. Zhao; Q. Zhang; K. N. Tu

doi:10.1016/j.mtadv.2020.100101

A high-entropy alloy as very low melting point solder for advanced electronic packaging

Y. Liu^*, L. Pu, Y. Yang^*, Q. He, Z. Zhou, C. Tan, X. Zhao, Q. Zhang, K. N. Tu

^*此作品的通讯作者

材料学院

科研成果: 期刊稿件 › 文章 › 同行评审

43 引用（Scopus）

摘要

SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

源语言	英语
文章编号	100101
期刊	Materials Today Advances
卷	7
DOI	https://doi.org/10.1016/j.mtadv.2020.100101
出版状态	已出版 - 9月 2020

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title = "A high-entropy alloy as very low melting point solder for advanced electronic packaging",

abstract = "SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.",

keywords = "Advanced electronic packaging technology, Diffusion kinetics, High-entropy alloy, Liquid-solid reactions, Pb-free solder",

author = "Y. Liu and L. Pu and Y. Yang and Q. He and Z. Zhou and C. Tan and X. Zhao and Q. Zhang and Tu, {K. N.}",

note = "Publisher Copyright: {\textcopyright} 2020 The Author(s)",

year = "2020",

month = sep,

doi = "10.1016/j.mtadv.2020.100101",

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T1 - A high-entropy alloy as very low melting point solder for advanced electronic packaging

AU - Liu, Y.

AU - Pu, L.

AU - Yang, Y.

AU - He, Q.

AU - Zhou, Z.

AU - Tan, C.

AU - Zhao, X.

AU - Zhang, Q.

AU - Tu, K. N.

PY - 2020/9

Y1 - 2020/9

N2 - SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

AB - SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

KW - Advanced electronic packaging technology

KW - Diffusion kinetics

KW - High-entropy alloy

KW - Liquid-solid reactions

KW - Pb-free solder

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DO - 10.1016/j.mtadv.2020.100101

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JO - Materials Today Advances

JF - Materials Today Advances

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A high-entropy alloy as very low melting point solder for advanced electronic packaging

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