@inproceedings{d9929dd47dd449afa2f1e5632bdce549,
title = "A bandpass filter using LTCC System-on-Package (SOP) Technology",
abstract = "LTCC System-on-Package (SOP) Technology is presently the most effective method for realizing the miniaturization of wireless front-end applications. In this paper, the development of highly integrated three-dimensional (3-D) filter solutions in multilayer low temperature co-fired ceramic (LTCC) technologies is presented for compact, low-cost wireless frontend modules utilizing system-on-package (SOP) technology. An asymmetrical dumbbell-shaped capacitor and wideband circuit design method was used to improve the filter characteristic. The embedded filter demonstrate an excellent performance (IL < 1 dB, 3dB BW ge; 27% at the centre frequency of 1.3 GHz) and great potential for high level of 3-D integration in wireless system. The BPF circuit is based on the quasi-lumped filter topology and some broadband technology was adopted. It has been simulated and optimized by Ansoft HFSS. The measured results agree very well with the full-wave electromagnetic designed responses.",
keywords = "Band Pass Filter (BPF), Low-Temperature Co-fired Ceramics (LTCC), Miniaturization, SOP",
author = "Bo Yuan and Yu, {Wei Hua} and Sun, {Hou Jun} and Xin Lv",
year = "2009",
doi = "10.1049/cp.2009.1315",
language = "English",
isbn = "9781849191401",
series = "IET Conference Publications",
number = "557 CP",
pages = "257--260",
booktitle = "2009 International Conference on Microwave Technology and Computational Electromagnetics, ICMTCE 2009",
edition = "557 CP",
note = "2009 International Conference on Microwave Technology and Computational Electromagnetics, ICMTCE 2009 ; Conference date: 03-11-2009 Through 06-11-2009",
}
