34.6 A 28nm 72.12TFLOPS/W Hybrid-Domain Outer-Product Based Floating-Point SRAM Computing-in-Memory Macro with Logarithm Bit-Width Residual ADC

Yiyang Yuan, Yiming Yang, Xinghua Wang*, Xiaoran Li, Cailian Ma, Qirui Chen, Meini Tang, Xi Wei, Zhixian Hou, Jialiang Zhu, Hao Wu, Qirui Ren, Guozhong Xing, Pui In Mak, Feng Zhang*

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

5 引用 (Scopus)

摘要

SRAM-based computing-in-memory (CIM) is considered crucial to achieving high-energy efficiency (EF) for artificial-intelligence (AI) applications on edge devices. Researchers are currently exploring floating-point (FP) CIM [1], [2], as integer (INT) precision CIMs [3] -[6] are no longer sufficient for new AI applications, which demand increased accuracy, complexity, and on-chip training. However, both analog and digital FP-CIMs face several significant challenges in realizing FP calculations, due to difficulties associated with handling high-bit precision: including (1) effectively combining the advantages of analog and digital CIMs while mitigating their respective drawbacks for high-bit-precision processing; (2) achieving optimal design trade-off for an analog-digital converter (ADC) necessitates the simultaneous consideration of bit precision, throughput, and overhead; (3) addressing the need for large fan-in multi-level adder trees in inner-based CIMs to sum high-bit-precision partial products, which can adversely impact overall EF, as shown in Fig. 34.6.1.

源语言英语
主期刊名2024 IEEE International Solid-State Circuits Conference, ISSCC 2024
出版商Institute of Electrical and Electronics Engineers Inc.
576-578
页数3
ISBN(电子版)9798350306200
DOI
出版状态已出版 - 2024
活动2024 IEEE International Solid-State Circuits Conference, ISSCC 2024 - San Francisco, 美国
期限: 18 2月 202422 2月 2024

出版系列

姓名Digest of Technical Papers - IEEE International Solid-State Circuits Conference
ISSN(印刷版)0193-6530

会议

会议2024 IEEE International Solid-State Circuits Conference, ISSCC 2024
国家/地区美国
San Francisco
时期18/02/2422/02/24

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