210°C reflow technology study in 3D Packaging

Lingyao Sun, Yaru Dong, Zhuangzhuang Hou, Xiuchen Zhao, Yongjun Huo, Ying Liu, Yingxia Liu

材料学院

Beijing Institute of Technology

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

Material Science