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张 文超
材料学院
h-index
3777
引用
33
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2010
2024
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(127)
相似学者
(13)
指纹图谱
深入其中 Wenchao Zhang 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Material Science
Polyhedral Oligomeric Silsesquioxane
100%
Flame Retardant
94%
Epoxy
94%
Silsesquioxane
59%
Smoke
41%
Oxide Compound
38%
Polycarbonate
31%
Thermal Stability
28%
Thermogravimetric Analysis
27%
Flexural Strength
24%
Nanocomposites
21%
Nuclear Magnetic Resonance
19%
Time-of-Flight Mass Spectrometry
16%
Matrix-Assisted Laser Desorption-Ionization
15%
Silicon
14%
Nanoparticle
14%
Lithium
13%
Dielectric Material
11%
Scanning Electron Microscopy
10%
Montmorillonite
10%
Thermal Property
10%
Copolymer
10%
Permittivity
9%
Sodium
9%
Structure (Composition)
9%
Glass Transition Temperature
8%
Thermal Conductivity
8%
Density
8%
Gas Chromatography Mass Spectrometry
8%
Dielectric Property
8%
Nanocrystalline Material
8%
Fourier Transform Infrared Spectroscopy
7%
X-Ray Diffraction
7%
Reinforced Composite
7%
Polylactide
7%
Metal-Organic Framework
6%
Ultimate Tensile Strength
6%
Calorimetry
6%
Nuclear Magnetic Resonance Spectroscopy
6%
Carbon Fiber
5%
Polymerization
5%
Polypropylene
5%
Ionic Liquid
5%
Vanadium
5%
Copolymerization
5%
Elastomer
5%
Mechanical Strength
5%
Engineering
Vinyl Ester Resin
23%
Cone Calorimeter
20%
Ammonium Polyphosphate
14%
Resin Composite
12%
Polycarbonate
10%
Smoke
9%
Limiting Oxygen Index
8%
Nanocomposite
7%
Synergistic Effect
5%
Chemical Structure
5%
Refractive
5%
Based Flame Retardant
5%
Fourier Transform
5%
Chemistry
Polyhedral Oligomeric Silsesquioxane
10%
Structure
10%
Flame Retardant
8%
Pyrolysis
7%
Thermogravimetric Analysis
7%
Matrix Assisted Laser Desorption Ionization - Time of Flight (MALDI-TOF)
7%
Condensation Reaction
6%
Silicon-29 Magnetic Resonance Spectroscopy
5%
Fourier Transform Infrared Spectroscopy
5%
Vanadium
5%
Macrocyclic Compound
5%
Copolymer
5%
Copolymerization
5%
Ethylene
5%
Polycarbonate
5%
Propene
5%
Poly(propylene)
5%
Density Functional Theory
5%
N-Heterocyclic Carbene
5%
Thermal Stability
5%
