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卢 士香
化学与化工学院
h-index
2757
引用
30
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2002
2024
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(125)
相似学者
(2)
指纹图谱
深入其中 Shixiang Lu 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Material Science
Superhydrophobic
100%
ZnO
62%
Density
40%
Graphene
31%
Contact Angle
27%
Solution
27%
Nanoparticle
26%
Aluminum
26%
Composite Material
24%
Reduced Graphene Oxide
23%
Optical Property
22%
Scanning Electron Microscopy
22%
Sol-Gel
21%
Annealing
21%
Capacitance
21%
Cobalt(II,III) Oxide
20%
Supercapacitors
19%
Zinc
19%
X-Ray Diffraction
19%
Corrosion Resistance
16%
X-Ray Photoelectron Spectroscopy
14%
Molecular Structure
14%
Wettability
13%
Film
13%
Titanium Dioxide
13%
Surface Morphology
12%
Corrosion
11%
Electronic Structure
11%
Catalyst Activity
11%
Supercapacitors Performance
11%
Graphene Oxide
10%
Tin
10%
Anti-Corrosion
9%
Electrodeposition
9%
Ultrahydrophobic Coating
9%
Energy Density
9%
Nanocrystalline Material
8%
Surface Plasmon
8%
Diffraction Pattern
8%
Conductive Material
7%
Thermal Conductivity
7%
Electronic Property
7%
Wear Resistance
7%
Sodium
7%
Surface Energy
6%
Palladium
6%
Photoluminescence
5%
Asymmetric Supercapacitor
5%
Luminescence
5%
Composite Structure
5%
Engineering
Copper Substrate
16%
Surface Morphology
15%
Energy Gap
10%
Aluminum Substrate
10%
Ray Photoelectron Spectroscopy
9%
Aqueous Solution
7%
Corrosion Resistance
7%
Composite Structure
7%
Sol-Gel Process
7%
Conductive
7%
Hydrophobic
6%
One Step
6%
Deposition Process
6%
Microscale
6%
Contact Angle Measurement
6%
Optimal Condition
6%
Mols
6%
Energy Engineering
5%
Deep Level
5%
Annealing Time
5%
Anti-Corrosion
5%
Graphene
5%
Conductive Material
5%
Durables
5%
Term Stability
5%
Nanoscale
5%
Surface Mesh
5%
Thermal Conductivity
5%
Chemistry
Structure
30%
Electron Affinity
10%
Density Functional Theory
9%
Molecular Structure
8%
DFT-B3LYP Calculation
8%
Optical Property
7%
Vibrational Frequency
6%
Molecular Orbital
6%
Band Gap
5%
4-Nitrophenol
5%
Photocatalytic
5%
Electronic Property
5%
Titanium Dioxide
5%
Enthalpy of Formation
5%
Sol Gel Process
5%