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化 麒麟
集成电路与电子学院
h-index
2738
引用
21
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2014
2024
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(64)
相似学者
(1)
指纹图谱
深入其中 Qilin Hua 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Material Science
Transistor
100%
Electron Mobility
85%
Piezoelectricity
73%
Light-Emitting Diode
72%
Nanowire
64%
Power Device
64%
Aluminum Nitride
63%
Quantum Well
58%
Nitride Compound
52%
Neuromorphic Computing
48%
Solar Cell
46%
Aluminum
43%
Hydrogel
43%
Heterojunction
38%
Density
38%
ZnO
36%
Film
34%
Photoluminescence
32%
Cobalt
29%
Indium
29%
Dielectric Material
29%
Aerogels
29%
Gallium
29%
Nanodots
29%
Gallium Nitride
29%
Electroceramics
29%
Quantum Dot
26%
Optical Property
22%
Electronic Circuit
21%
Laser Diode
17%
Schottky Barrier
17%
Indium Tin Oxide
16%
Carbon Nanotube
16%
Doping (Additives)
14%
Bismuth
14%
Acoustic Device
14%
Display Device
14%
Nanocrystalline Material
14%
Field Effect Transistor
14%
Perovskite
14%
Device Integration
14%
Solid Interface
14%
Functional Material
14%
Polymer Films
14%
Polyimide
14%
Poly Methyl Methacrylate
14%
Nanorod
14%
Wet Etching
14%
MXene
14%
Dry Etching
14%
Engineering
Artificial Intelligence
53%
Power Device
52%
Triboelectric Nanogenerators
49%
Device Performance
47%
Quantum Well
43%
Light-Emitting Diode
43%
Switching Threshold
43%
Performance Output
41%
Human-Machine Interface
38%
Piezoelectric
33%
Power Electronics
33%
Output Power
33%
Heterojunctions
32%
Aerogels
29%
Internals
26%
Magnetic Field
26%
Wearable Electronics
25%
Nitride
24%
High Resolution
24%
Neuromorphic System
21%
Nanowires
21%
Optoelectronic Device
20%
Dielectrics
19%
Current Output
19%
External Stress
19%
Gate Dielectric
19%
Prosthetics
18%
Sensor Network
18%
Potential Application
17%
Electrical Output
17%
Solid Contact
17%
Optoelectronics
16%
Synergistic Effect
16%
Self-Powered
16%
Gate Bias
15%
Prosthetics
14%
Perovskite Solar Cells
14%
Metal Oxide Semiconductor
14%
Barrier Height
14%
Heat Losses
14%
Industrial Applications
14%
Temperature Estimation
14%
Applied Strain
14%
Field Pressure
14%
Microscale
14%
Rapid Thermal Processing
14%
Point Memory
14%
Sensor Array
14%
Engineering
14%
Alternating Current
14%
