跳到主要导航
跳到搜索
跳到主要内容
北京理工大学 首页
English
中文
首页
师资队伍
研究单位
科研成果
奖项
按专业知识、名称或附属进行搜索
查看 Scopus 资料
蒋 剑良
光电学院
h-index
158
引用
7
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
1997 …
2024
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(38)
相似学者
(2)
指纹图谱
深入其中 Jianliang Jiang 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Engineering
Absorption Coefficient
27%
Analytical Model
43%
Antenna
20%
Automatic Gain Control
16%
Bridge Decks
16%
Complementary Metal-Oxide-Semiconductor
16%
Crosstalk
16%
Deep Hole
16%
Digital Video
16%
Dynamic Range
16%
Energy Engineering
31%
Experimental Result
23%
External Quantum Efficiency
16%
Fiber Optic Sensor
16%
Field Effect Transistor
16%
Filter Circuit
16%
Finite Difference Method
16%
Finite Element Method
16%
Global Positioning System
16%
Growth Condition
16%
Holograms
32%
Infrared Absorption
16%
Innoslab Laser
16%
Interferometric Fiber Optic Sensor
16%
Intermediate Band Solar Cell
16%
Light-Emitting Diode
16%
Loop Antenna
16%
Matching Network
36%
Micro Strip
16%
Microelectromechanical System
16%
Micromirrors
32%
Nitride
20%
Numerical Modeling
16%
Optimal Design
16%
Optoelectronics
16%
Output Power
52%
Patch Antenna
16%
Power Amplifier
97%
Power Loss
16%
Quantum Confinement
16%
Quantum Dot
100%
Radio Frequency Identification
40%
Schr Dinger Equation
17%
Simulation Result
19%
Sintering
16%
Solar Cell
67%
Superlattice
32%
Surveillance System
40%
Temperature Field
21%
Thermal Effect
16%
Material Science
Absorption
5%
Al2O3
5%
Aluminum Nitride
5%
Capacitance
8%
Crystal Structure
8%
Density
5%
Electronic Circuit
16%
Fiber Optics
16%
Finite Element Modeling
16%
Gallium Arsenide
25%
Gallium Nitride
16%
II-VI Semiconductor
8%
III Nitride Materials
5%
Indium
19%
Intermediate Band Solar Cell
32%
Large Deformation
10%
Laser Source
16%
Light-Emitting Diode
16%
Materials Property
16%
Optical Property
64%
Photovoltaics
8%
Protective Coating
16%
Quantum Dot
100%
Refractive Index
8%
Resonator
16%
Scanning Electron Microscopy
8%
Silicon
16%
Silicon Wafer
16%
Sintering
16%
Sodium
16%
Solar Cell
45%
Superlattice
32%
Surface Morphology
8%
Thermal Analysis
16%
Wet Etching
8%
