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夏 焕雄
机械与车辆学院
h-index
764
引用
13
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2011
2025
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(71)
指纹图谱
深入其中 Huanxiong Xia 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Engineering
Additive Manufacturing Technology
22%
Anodizing
26%
Assembly Process
38%
Bondlines
22%
Chemical Vapor Deposition
73%
Computer Simulation
43%
Constitutive Model
28%
Curing Temperature
25%
Defects
59%
Degree of Freedom
22%
Deposition Rate
31%
Design Solution
28%
Digital Image Correlation
56%
Face Plate
42%
Finite Element Method
42%
Finite Element Modeling
22%
Finite Element Simulation
28%
Fits and Tolerances
33%
Flow Field
38%
Fluid Flow
39%
Fused Deposition Modeling
50%
Gas Flow
50%
Joints (Structural Components)
50%
Kinetic Model
23%
Kinetic Parameter
18%
Low-Temperature
33%
Microstructure
19%
Module Design
33%
Multiphase Flows
22%
Nitride
33%
Numerical Optimization
33%
Numerical Study
59%
Optimization Method
21%
Powder Bed
21%
Process Chamber
32%
Process Factor
19%
Process Parameter
22%
Process Planning
25%
Reduced Order Model
50%
Reliability Index
19%
Residual Stress
45%
Selective Laser Melting
35%
Selective Laser Melting Process
25%
Shear Strength
50%
Spatial Distribution
19%
Temperature Distribution
28%
Temperature Profile
33%
Thermal Field
22%
Thin Films
59%
Vapor Deposition
73%
Material Science
Aluminum Alloys
16%
Anodizing
14%
Bonded Joint
20%
Carrier Concentration
16%
Chemical Vapor Deposition
16%
Contact Area
8%
Contact Mechanics
11%
Cure Process
5%
Dielectric Material
16%
Differential Scanning Calorimetry
14%
Elastic Moduli
16%
Film
8%
Film Growth
21%
Finite Element Method
8%
Finite Element Modeling
39%
Fluid Flow
32%
Fused Filament Fabrication
33%
Gas Flow
16%
Glass Transition Temperature
16%
Hydrogen Bonding
16%
Inconel 718
16%
Lamellar Structure
5%
Liquid Interface
5%
Mechanical Strength
59%
Multiphase Flow
25%
Nucleation
8%
Permittivity
8%
Plasma-Enhanced Chemical Vapor Deposition
16%
Plastic Deformation
8%
Polyetheretherketone
16%
Polysiloxane
16%
Powder
26%
Residual Stress
8%
Rod
16%
Selective Laser Melting
56%
Silicon
6%
Silicon Alloys
16%
Silicon Nitride
16%
Solidification
100%
Static Loading
16%
Structure Type
16%
Surface Tension
12%
Thermoset Plastics
33%
Thin Film Deposition
8%
Thin Films
16%
Three Dimensional Printing
9%
Ti-6Al-4V
16%
Wet Etching
16%
Wettability
5%
Work Hardening
16%
