Ultrafine-grained copper prepared by spark plasma sintering process

Zhao Hui Zhang*, Fu Chi Wang, Lin Wang, Shu Kui Li

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

110 Citations (Scopus)

Abstract

Spark plasma sintering (SPS) parameters including pressure, temperature, holding time and heating rate were considered and optimized to investigate the sintering process of bulk copper. The relationship between the sintering parameters and the microstructure of the bulk compact were obtained and studied. It was concluded that large-size ultrafine-grained copper with an average grain size less than 2.2 μm and a relative density greater than 96% could be prepared by the SPS process with initial pressure of 1 MPa, holding pressure of 50 MPa, sintering temperature of 750 °C, holding time of 6 min and heating rate of 80 °C/min. The production process improved the mechanical properties.

Original languageEnglish
Pages (from-to)201-205
Number of pages5
JournalMaterials Science and Engineering: A
Volume476
Issue number1-2
DOIs
Publication statusPublished - 15 Mar 2008

Keywords

  • Densification
  • Grain size
  • Spark plasma sintering
  • Ultrafine-grained copper

Fingerprint

Dive into the research topics of 'Ultrafine-grained copper prepared by spark plasma sintering process'. Together they form a unique fingerprint.

Cite this