TY - GEN
T1 - Thermo-mechanical reliability evaluation of PLCC packaging
AU - Guo, Xiang Hui
AU - Xu, Chun Guang
AU - Yang, Liu
PY - 2013
Y1 - 2013
N2 - Thermo-mechanical failure is the main factor to impact the microelectronic packaging reliability. Under thermal loads, the microelectronic packaging is easy to produce cracks, delamination, voids, and other defects, which can emerge and grow under thermo-mechanical stresse caused by the different coefficients of thermal expansion (CTE). Firstly, a geometric model of Plastic Leaded Chip Carrier (PLCC) packaging was established and the thermo-mechanical property of PLCC packaging was analyzed using finite element analysis (FEA) software ANSYS. Then, the thermal cycling test on a set of PLCC packaging was conducted according to the MIL-STD-883H Microcircuits Test Method Standard with temperature range from -65? to 150?, and the crack growth rate of PLCC packaging was studied experimentally using Scanning Acoustic Microscopy (SAM). Finally, the Anand model was adopted to predict thermal fatigue life, which was consistent with the experimental results. With these researches, the thermo-mechanical reliability evaluation of the PLCC packaging was investigated using finite element analysis (FEA) combined with analytical methods.
AB - Thermo-mechanical failure is the main factor to impact the microelectronic packaging reliability. Under thermal loads, the microelectronic packaging is easy to produce cracks, delamination, voids, and other defects, which can emerge and grow under thermo-mechanical stresse caused by the different coefficients of thermal expansion (CTE). Firstly, a geometric model of Plastic Leaded Chip Carrier (PLCC) packaging was established and the thermo-mechanical property of PLCC packaging was analyzed using finite element analysis (FEA) software ANSYS. Then, the thermal cycling test on a set of PLCC packaging was conducted according to the MIL-STD-883H Microcircuits Test Method Standard with temperature range from -65? to 150?, and the crack growth rate of PLCC packaging was studied experimentally using Scanning Acoustic Microscopy (SAM). Finally, the Anand model was adopted to predict thermal fatigue life, which was consistent with the experimental results. With these researches, the thermo-mechanical reliability evaluation of the PLCC packaging was investigated using finite element analysis (FEA) combined with analytical methods.
KW - FEA
KW - PLCC packaging
KW - SAM
KW - Thermo-mechanical reliability
UR - http://www.scopus.com/inward/record.url?scp=84886423255&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.816-817.795
DO - 10.4028/www.scientific.net/AMR.816-817.795
M3 - Conference contribution
AN - SCOPUS:84886423255
SN - 9783037858677
T3 - Advanced Materials Research
SP - 795
EP - 799
BT - Manufacturing Science and Technology (ICMST2013)
T2 - 4th International Conference on Manufacturing Science and Technology, ICMST 2013
Y2 - 3 August 2013 through 4 August 2013
ER -