Thermal protection materials based on epoxy-containing and phenyl-containing polyhedral oligomeric silsesquioxane modified phenolic resin and phenolic resin/carbon fiber composites

Fan Yang, Jian Li, Wenchao Zhang*, Jiyu He, Rongjie Yang, Jianfeng Huang, Xin Zhang, Wenyuan Zhang

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

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