The heat conduction model and leakage characterization of the sealing interface

S. Wang, X. F. Yao*, H. Yang

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Fingerprint

Dive into the research topics of 'The heat conduction model and leakage characterization of the sealing interface'. Together they form a unique fingerprint.

Engineering

Material Science