Structure driven piezoresistive performance design for rubbery composites-based sensors and application prospect: a review

Jiachen Shang, Heng Yang*, Xuefeng Yao, Haosen Chen

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

1 Citation (Scopus)

Abstract

Recently, flexible pressure and strain sensors have attracted the attention of researchers because of their high sensitivity, broad strain-sensing ability, and various forms. Flexible sensors have essential applications and broad market prospects in fields such as wearable electronics, intelligent machines, and structural health monitoring. At the same time, these emerging fields also require more significant performance requirements for flexible sensors. Conductive rubber composite materials have high tensile strength, high electromechanical sensitivity, and high stability, making them ideal for fabricating of high-performance flexible pressure sensors. Therefore, further improving the performance of conductive flexible rubber composite pressure sensors is developmental focus. In this review, the preparation and electromechanical response mechanisms of conductive polymer composites are summarized, and methods for improving the performance of flexible sensors through structural design are introduced, including conductive network structural design, substrate structural design, and conductive polymer composite structural design. In addition, the main applications of flexible pressure sensors are introduced. Finally, problems in developing flexible sensors are summarized, and future development directions are discussed.[Figure not available: see fulltext.].

Translated title of the contribution结构设计驱动的橡胶类复合材料柔性传感器压阻性能设计 研究进展
Original languageEnglish
Article number423211
JournalActa Mechanica Sinica/Lixue Xuebao
Volume40
Issue number1
DOIs
Publication statusPublished - Jan 2024

Keywords

  • Conductive rubber composites
  • Electromechanical mechanism
  • Flexible sensors
  • Sensor applications
  • Structure design

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