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Silicon molding techniques for integrated power MEMS inductors
M. Wang, J. Li
*
, K. Ngo,
H. Xie
*
Corresponding author for this work
University of Florida
Virginia Tech College of Engineering
Research output
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Contribution to journal
›
Article
›
peer-review
16
Citations (Scopus)
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Engineering
Microelectromechanical System
100%
Silicon Substrate
100%
Transients
33%
DC-to-DC Converter
33%
Silicon Wafer
33%
Thermal Stress
33%
Portable Electronics
33%
Electrical Isolation
33%
Monolithic Integration
33%
Metal Layer
33%
Core Loss
33%
Power Inductors
33%