Signal processing and analysis for copper layer thickness measurement within a large variation range in the CMP process

Hongkai Li, Qian Zhao, Xinchun Lu, Jianbin Luo

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Signal processing and analysis for copper layer thickness measurement within a large variation range in the CMP process'. Together they form a unique fingerprint.

Engineering