@inproceedings{d431bbc7e43041428e4d95bf7fd512fd,
title = "Signal Integrity Simulation Design and Analysis of Electronic Article Surveillance PCB for RFID applications",
abstract = "The modern electronics industry is working for miniaturization of electronic devices will ultimately call for the dense design of PCB, shrinking geometry of ICs and high speed interference. Mostly communication devices operate on low power and high frequency. As shrinking of the silicon wafer area significantly increases the interconnection problems. Crosstalk, impedance mismatch, reflection, skew, and propagation delay are major issues that are caused by interconnection and limit the performance of the high-speed design. This paper presents Signal Integrity (SI) simulation design analysis by using Cadence Allegro SPB Software. For this purpose, Input/Output Buffer Information Specification (IBIS) models are assigned to simulate reflection and crosstalk. Signal integrity analysis is performed and improvement in simulation design is presented which enhances the design intuitively and validates high speed PCB analysis.",
keywords = "Crosstalk, High speed PCB design, IBIS model, Power integrity, Reflection, Signal integrity",
author = "Zahid, {Muhammad Noaman} and Jianliang Jiang and Heng Lu and Rashid Ali and Deborah Eric and Shahrukh Khan and Hengli Zhang",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 3rd IEEE International Conference of Safe Production and Informatization, IICSPI 2020 ; Conference date: 28-11-2020 Through 30-11-2020",
year = "2020",
month = nov,
day = "28",
doi = "10.1109/IICSPI51290.2020.9332408",
language = "English",
series = "Proceedings of 2020 IEEE 3rd International Conference of Safe Production and Informatization, IICSPI 2020",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "600--604",
editor = "Guorong Chen",
booktitle = "Proceedings of 2020 IEEE 3rd International Conference of Safe Production and Informatization, IICSPI 2020",
address = "United States",
}