Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process

Zhongyi Liu; Ruoqin Wang; Gai Yang; Xinyuan Zhang; Rui Jiao; Xuejiao Li; Jiali Qi; Hongyu Yu; Huikai Xie; Xiaoyi Wang

doi:10.1109/MEMS49605.2023.10052330

Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process

Zhongyi Liu, Ruoqin Wang, Gai Yang, Xinyuan Zhang, Rui Jiao, Xuejiao Li, Jiali Qi, Hongyu Yu, Huikai Xie^*, Xiaoyi Wang^*

^*Corresponding author for this work

School of Integrated Circuits and Electronics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Abstract

For the first time, a CMOS compatible calorimetric flow sensor with a dual-heater (DH) structure is proposed instead of using the traditional single-heater (SH) design. CFD simulation results demonstrated that the DH design can enhance the performance of the device with high sensitivity. Thereof, the DH sensor was fabricated with four suspended bridges and tested under three configuration modes: parallel-heater (PH) mode, full-bridge (FB) mode, and half-bridge (HB) mode. Experimental results demonstrated that the PH mode can achieve a high sensitivity of 403.25 mV/(m/s)/W, which is over 4 times that of the HB mode (83.7mV/(m/s)/W). This DH flow sensor under its PH mode can also provide an ultra large measurement range (±40 m/s) and fast response time (1.8 ms @16.7 m/s). The good performance of this novel flow sensor demonstrated its potential applications in respiration monitoring in medical areas and airflow control in HVAC systems for smart buildings.

Original language	English
Title of host publication	2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	267-270
Number of pages	4
ISBN (Electronic)	9781665493086
DOIs	https://doi.org/10.1109/MEMS49605.2023.10052330
Publication status	Published - 2023
Event	36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023 - Munich, Germany Duration: 15 Jan 2023 → 19 Jan 2023

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume	2023-January
ISSN (Print)	1084-6999

Conference

Conference	36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023
Country/Territory	Germany
City	Munich
Period	15/01/23 → 19/01/23

Keywords

CMOS compatible
dual-heater
flow sensor

Access to Document

10.1109/MEMS49605.2023.10052330

Cite this

Liu, Z., Wang, R., Yang, G., Zhang, X., Jiao, R., Li, X., Qi, J., Yu, H., Xie, H., & Wang, X. (2023). Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process. In 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023 (pp. 267-270). (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2023-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMS49605.2023.10052330

Liu, Zhongyi ; Wang, Ruoqin ; Yang, Gai et al. / Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process. 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 267-270 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{dd1fa073ecb840ee9b16c5d346d547cc,

title = "Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process",

abstract = "For the first time, a CMOS compatible calorimetric flow sensor with a dual-heater (DH) structure is proposed instead of using the traditional single-heater (SH) design. CFD simulation results demonstrated that the DH design can enhance the performance of the device with high sensitivity. Thereof, the DH sensor was fabricated with four suspended bridges and tested under three configuration modes: parallel-heater (PH) mode, full-bridge (FB) mode, and half-bridge (HB) mode. Experimental results demonstrated that the PH mode can achieve a high sensitivity of 403.25 mV/(m/s)/W, which is over 4 times that of the HB mode (83.7mV/(m/s)/W). This DH flow sensor under its PH mode can also provide an ultra large measurement range (±40 m/s) and fast response time (1.8 ms @16.7 m/s). The good performance of this novel flow sensor demonstrated its potential applications in respiration monitoring in medical areas and airflow control in HVAC systems for smart buildings.",

keywords = "CMOS compatible, dual-heater, flow sensor",

author = "Zhongyi Liu and Ruoqin Wang and Gai Yang and Xinyuan Zhang and Rui Jiao and Xuejiao Li and Jiali Qi and Hongyu Yu and Huikai Xie and Xiaoyi Wang",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023 ; Conference date: 15-01-2023 Through 19-01-2023",

year = "2023",

doi = "10.1109/MEMS49605.2023.10052330",

language = "English",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "267--270",

booktitle = "2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023",

address = "United States",

}

Liu, Z, Wang, R, Yang, G, Zhang, X, Jiao, R, Li, X, Qi, J, Yu, H, Xie, H & Wang, X 2023, Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process. in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2023-January, Institute of Electrical and Electronics Engineers Inc., pp. 267-270, 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023, Munich, Germany, 15/01/23. https://doi.org/10.1109/MEMS49605.2023.10052330

Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process. / Liu, Zhongyi; Wang, Ruoqin; Yang, Gai et al.
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 267-270 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2023-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process

AU - Liu, Zhongyi

AU - Wang, Ruoqin

AU - Yang, Gai

AU - Zhang, Xinyuan

AU - Jiao, Rui

AU - Li, Xuejiao

AU - Qi, Jiali

AU - Yu, Hongyu

AU - Xie, Huikai

AU - Wang, Xiaoyi

PY - 2023

Y1 - 2023

N2 - For the first time, a CMOS compatible calorimetric flow sensor with a dual-heater (DH) structure is proposed instead of using the traditional single-heater (SH) design. CFD simulation results demonstrated that the DH design can enhance the performance of the device with high sensitivity. Thereof, the DH sensor was fabricated with four suspended bridges and tested under three configuration modes: parallel-heater (PH) mode, full-bridge (FB) mode, and half-bridge (HB) mode. Experimental results demonstrated that the PH mode can achieve a high sensitivity of 403.25 mV/(m/s)/W, which is over 4 times that of the HB mode (83.7mV/(m/s)/W). This DH flow sensor under its PH mode can also provide an ultra large measurement range (±40 m/s) and fast response time (1.8 ms @16.7 m/s). The good performance of this novel flow sensor demonstrated its potential applications in respiration monitoring in medical areas and airflow control in HVAC systems for smart buildings.

AB - For the first time, a CMOS compatible calorimetric flow sensor with a dual-heater (DH) structure is proposed instead of using the traditional single-heater (SH) design. CFD simulation results demonstrated that the DH design can enhance the performance of the device with high sensitivity. Thereof, the DH sensor was fabricated with four suspended bridges and tested under three configuration modes: parallel-heater (PH) mode, full-bridge (FB) mode, and half-bridge (HB) mode. Experimental results demonstrated that the PH mode can achieve a high sensitivity of 403.25 mV/(m/s)/W, which is over 4 times that of the HB mode (83.7mV/(m/s)/W). This DH flow sensor under its PH mode can also provide an ultra large measurement range (±40 m/s) and fast response time (1.8 ms @16.7 m/s). The good performance of this novel flow sensor demonstrated its potential applications in respiration monitoring in medical areas and airflow control in HVAC systems for smart buildings.

KW - CMOS compatible

KW - dual-heater

KW - flow sensor

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U2 - 10.1109/MEMS49605.2023.10052330

DO - 10.1109/MEMS49605.2023.10052330

M3 - Conference contribution

AN - SCOPUS:85149864703

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 267

EP - 270

BT - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023

Y2 - 15 January 2023 through 19 January 2023

ER -

Liu Z, Wang R, Yang G, Zhang X, Jiao R, Li X et al. Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process. In 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 267-270. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMS49605.2023.10052330

Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process

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Keywords

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