Molecular dynamics simulation for ideal strength and elastic modulus of SiC associated with temperature and vacancy defects

C. Wang*, J. Liang, Y. Liu, X. Luan

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Fingerprint

Dive into the research topics of 'Molecular dynamics simulation for ideal strength and elastic modulus of SiC associated with temperature and vacancy defects'. Together they form a unique fingerprint.

Material Science