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Modeling of coupled temperature-displacement-diffusion problem for silica-phenolic composite under high temperature
Shengbo Shi,
Jun Liang
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Corresponding author for this work
Harbin Institute of Technology
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Article
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peer-review
4
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Dive into the research topics of 'Modeling of coupled temperature-displacement-diffusion problem for silica-phenolic composite under high temperature'. Together they form a unique fingerprint.
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Engineering
Diffusion Problem
100%
Phenolics
100%
Elastomer
66%
Resin Matrix
66%
Mass Transfer
33%
Heat Flux
33%
Obtains
33%
Strain
33%
Conservation Equation
33%
Finite Element Method
33%
Gaussians
33%
Temperature Distribution
33%
Strain State
33%
Heat Transfer
33%
Plane Strain
33%
Diffusion Equation
33%
Gas-Phase
33%
Ablation Process
33%
Stress Field
33%
Radiant Heat
33%
Material Science
Silicon Dioxide
100%
Elastomer
66%
Thermomechanical Property
33%
Finite Element Method
33%
Transfer Process
33%
Stress Field
33%
Thermophysical Property
33%