Microstructures and properties of electrodeposited Cu-Bi composite coatings

Copper-based composites are widely used in industry due to their desired properties. In this research, a Cu-Bi composite coating was successfully developed by electroplating. Current density was varied from 10-100 mA/cm² and deposition time was selected for preparing the samples. The properties of Cu-Bi coatings were characterised with comparison to pure Cu coating. Results showed that incorporation of Bi into Cu, refined the microstructure and improved the mechanical properties of coatings. The deposition current densities played an important role in producing good results. At a high current density of 100 mA/cm², porous microstructure was formed and caused inferior mechanical properties. However, the electrochemical or corrosion properties of the Cu-Bi composite were only slightly improved compared to the pure Cu coating.