TY - GEN
T1 - Microneedle roller electrode array (M-REA)
T2 - 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
AU - Huang, Dong
AU - Zhao, Deyao
AU - Huang, Yuanyu
AU - Liang, Zicai
AU - Li, Zhihong
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/24
Y1 - 2018/4/24
N2 - This paper reports a novel device, so-called microneedle roller electrode array (M-REA), for minimally invasive in vivo electric gene delivery, which utilizes parallel circular blades with microneedle arrays on the edge as electrodes. The microneedle arrays are fabricated by planar laser micromachining. Owing to reduced resistance by penetrating stratum corneum and small gaps between electrodes, electric gene delivery by electroporation can be achieved under low voltage. Additionally, our device provides ability of large area electroporation and causes less damage on the target tissue, benefiting from rolling operation, less invasiveness, good biocompatibility and low voltage. Furthermore, low cost fabrication and convenient operation offer vast potential for practical clinical applications.
AB - This paper reports a novel device, so-called microneedle roller electrode array (M-REA), for minimally invasive in vivo electric gene delivery, which utilizes parallel circular blades with microneedle arrays on the edge as electrodes. The microneedle arrays are fabricated by planar laser micromachining. Owing to reduced resistance by penetrating stratum corneum and small gaps between electrodes, electric gene delivery by electroporation can be achieved under low voltage. Additionally, our device provides ability of large area electroporation and causes less damage on the target tissue, benefiting from rolling operation, less invasiveness, good biocompatibility and low voltage. Furthermore, low cost fabrication and convenient operation offer vast potential for practical clinical applications.
UR - http://www.scopus.com/inward/record.url?scp=85047002086&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2018.8346572
DO - 10.1109/MEMSYS.2018.8346572
M3 - Conference contribution
AN - SCOPUS:85047002086
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 400
EP - 403
BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 21 January 2018 through 25 January 2018
ER -