TY - JOUR
T1 - Mechanical and thermal properties and flame retardancy of phosphorus-containing polyhedral oligomeric silsesquioxane (DOPO-POSS)/ polycarbonate composites
AU - Zhang, Wenchao
AU - Li, Xiangmei
AU - Guo, Xiaoyan
AU - Yang, Rongjie
PY - 2010/12
Y1 - 2010/12
N2 - A novel polyhedral oligomeric silsesquioxane containing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-POSS) has been incorporated into polycarbonate (PC) composites in order to study its effect on mechanical and thermal properties and flame retardancy. The mechanical and thermal properties of the DOPO-POSS/PC composites have been investigated by tensile and flexural testing, DSC, and DMA. Slight enhancements of yield stress, and flexural strength and modulus, and obvious decreases of fracture strength and strain of the DOPO-POSS/PC composites were observed with an increase in DOPO-POSS loading. The glass transition temperatures (Tg) of the composites were reduced with increasing DOPO-POSS loading. The morphology of the PC composites was evaluated by SEM, which indicated that the DOPO-POSS was dispersed with a particle size of 100-250 nm in the PC matrix. The thermal degradation behaviour and flame retardancies of PC composites with different DOPO-POSS loadings were investigated by TGA, LOI, UL-94 standard, and cone calorimetry. The composite had an LOI value of 30.5 and a UL-94 rating V-0 when the content of DOPO-POSS was 4%.
AB - A novel polyhedral oligomeric silsesquioxane containing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-POSS) has been incorporated into polycarbonate (PC) composites in order to study its effect on mechanical and thermal properties and flame retardancy. The mechanical and thermal properties of the DOPO-POSS/PC composites have been investigated by tensile and flexural testing, DSC, and DMA. Slight enhancements of yield stress, and flexural strength and modulus, and obvious decreases of fracture strength and strain of the DOPO-POSS/PC composites were observed with an increase in DOPO-POSS loading. The glass transition temperatures (Tg) of the composites were reduced with increasing DOPO-POSS loading. The morphology of the PC composites was evaluated by SEM, which indicated that the DOPO-POSS was dispersed with a particle size of 100-250 nm in the PC matrix. The thermal degradation behaviour and flame retardancies of PC composites with different DOPO-POSS loadings were investigated by TGA, LOI, UL-94 standard, and cone calorimetry. The composite had an LOI value of 30.5 and a UL-94 rating V-0 when the content of DOPO-POSS was 4%.
KW - DOPO
KW - Flame retardancy
KW - Organic phosphorus compound
KW - POSS
KW - Polycarbonate
KW - Polyhedral oligomeric silsesquioxane
UR - http://www.scopus.com/inward/record.url?scp=78649442940&partnerID=8YFLogxK
U2 - 10.1016/j.polymdegradstab.2010.07.036
DO - 10.1016/j.polymdegradstab.2010.07.036
M3 - Article
AN - SCOPUS:78649442940
SN - 0141-3910
VL - 95
SP - 2541
EP - 2546
JO - Polymer Degradation and Stability
JF - Polymer Degradation and Stability
IS - 12
ER -