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Mechanical analysis of adhesion between wearable electronics and human skin based on crack theory of bi-material interface
Yutong Fu,
Heng Yang
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Corresponding author for this work
Institute of Advanced Structure Technology
Chongqing University
Research output
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Article
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peer-review
5
Citations (Scopus)
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Engineering
Wearable Electronics
100%
Human Skin
100%
Material Interface
100%
Theoretical Basis
20%
Periodic Time
20%
Flexible Electronics
20%
Geometric Parameter
20%
Human Health
20%
Skin Surface
20%
Extended Period
20%
Material Science
Mechanical Testing
100%
Interface (Material)
100%
Surface Stress
50%