Material extrusion 3D printing of large-scale SiC honeycomb metastructure for ultra-broadband and high temperature electromagnetic wave absorption

Wenqing Wang, Zengchan Li, Xiong Gao, Yixing Huang*, Rujie He

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Material extrusion 3D printing of large-scale SiC honeycomb metastructure for ultra-broadband and high temperature electromagnetic wave absorption'. Together they form a unique fingerprint.

Engineering

Physics

Material Science