Investigation of the residual stress in reaction-bonded SiC under irradiation

Engineering

• Coefficient of Thermal Expansion 33%
• Demonstrates 33%
• Expansion Coefficient 33%
• Initiation of Crack 33%
• Low-Temperature 33%
• Nanoindentation Test 33%
• Nuclear Reactor 33%
• Residual Stress 100%
• Room Temperature 33%
• Thermal Stress 66%

Material Science

• Piezospectroscopy 33%