Investigating the valence balance of adding Nano SiC and MWCNTs on the improvement properties of copper composite using mechanical alloying and SPS techniques

Hossein Ahmadian, Ahmed Fouly*, Tianfeng Zhou, A. Senthil Kumar, A. Fathy, Guo Weijia

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

20 Citations (Scopus)

Abstract

This study presents a comprehensive investigation of copper-based nanocomposites reinforced with silicon carbide (SiC) nanoparticles and multi-walled carbon nanotubes (MWCNTs). The manufacturing procedure involved powder metallurgy techniques followed by spark plasma sintering (SPS). Microstructural analysis revealed a notable reduction in particle size (from 23.72 μm to 18.31 μm) and crystallite size (from 104.32 nm to 87.36 nm) with the addition of reinforcements. The bulk microstructure exhibited a reduction in grain size by approximately 13.1 %. XRD analysis confirmed the absence of new phases. Evaluation of SPS parameters demonstrated varying density and porosity, with the highest relative density of 99.96 % observed in pure copper composites. Hardness measurements indicated that surface hardness surpassed cross-sectional values, with the lowest recorded value being 64.79 HV for composite Cu-5%SiC-1%MWCNTs (S4). Wear rate analysis revealed an increase, with pure copper composites exhibiting a wear rate of 1.78 × 10^-4 mm3/m, while composite S4 displayed a rate of 3.25 × 10^-4 mm3/m under a load of 5 N. Coefficient of Friction (COF) exhibited significant fluctuations, influenced by the applied load and composite composition. Thermal conductivity decreased with higher SiC and MWCNT content, with sample S1 exhibiting the highest thermal conductivity among reinforced composites. Electrical conductivity trends were influenced by the type and concentration of reinforcing particles, resulting in an increase of approximately six times in composite S4 compared to the pure sample.

Original languageEnglish
Article number111113
JournalDiamond and Related Materials
Volume145
DOIs
Publication statusPublished - May 2024

Keywords

  • Copper-based composites
  • Electrical conductivity
  • Powder metallurgy
  • Spark plasma sintering (SPS)
  • Thermal conductivity
  • Wear resistance

Fingerprint

Dive into the research topics of 'Investigating the valence balance of adding Nano SiC and MWCNTs on the improvement properties of copper composite using mechanical alloying and SPS techniques'. Together they form a unique fingerprint.

Cite this