TY - GEN
T1 - Highly Sensitive 2D Thermoresistive Micro Calorimetric Flow Sensor by Using 0.35\boldsymbol{\mu}\mathbf{m} CMOS MEMS Technology
AU - Xu, Wei
AU - Wang, Ruijie
AU - Wang, Xiaoyi
AU - Mousa, Basant
AU - Lee, Yi Kuen
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - We report a two-dimensional (2D) Thermoresistive Micro Calorimetric Flow (TMCF) sensor by using a 0.35 \mu \mathrm{m} 2P4M CMOS MEMS technology. For the nitrogen gas flow, the fabricated 2D flow sensor achieves a prominent normalized sensitivity of 60.6 mV/W/(m/s). To overcome the sensor output drifting issue due to the locally redistributed fluid flow near the bonding wires, a digital signal conditioning algorithm by using the inverse distance weighting (IDW) method, instead of the conventional fitting with sine and cosine function, was proposed. Accordingly, this 2D flow sensor system shows the excellent velocity accuracy of ±4% and the angle accuracy of ±2°. Therefore, the fabricated highly sensitive 2D TMCF sensor will be a promising flow device for the smart buildings and the meteorological monitoring system.
AB - We report a two-dimensional (2D) Thermoresistive Micro Calorimetric Flow (TMCF) sensor by using a 0.35 \mu \mathrm{m} 2P4M CMOS MEMS technology. For the nitrogen gas flow, the fabricated 2D flow sensor achieves a prominent normalized sensitivity of 60.6 mV/W/(m/s). To overcome the sensor output drifting issue due to the locally redistributed fluid flow near the bonding wires, a digital signal conditioning algorithm by using the inverse distance weighting (IDW) method, instead of the conventional fitting with sine and cosine function, was proposed. Accordingly, this 2D flow sensor system shows the excellent velocity accuracy of ±4% and the angle accuracy of ±2°. Therefore, the fabricated highly sensitive 2D TMCF sensor will be a promising flow device for the smart buildings and the meteorological monitoring system.
UR - http://www.scopus.com/inward/record.url?scp=85074321832&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2019.8870857
DO - 10.1109/MEMSYS.2019.8870857
M3 - Conference contribution
AN - SCOPUS:85074321832
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 716
EP - 719
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -