Heterodimensional structure with enhanced interface loss for microwave absorption and EMI shielding

Hong Zhou Guan, Zhan Zhan Wang, Meng Qi Wang, Hua Zhang Zhai*, Mao Sheng Cao*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The study of high-performance multifunctional electromagnetic materials is one of the inevitable challenges in the field of electromagnetic wave (EMW) absorption. In order to improve the attenuation ability of EMW and broaden the frequency range of absorbing materials, rational design of material structure and interface is an important way to optimize the effective absorption bandwidth (EAB). Therefore, enhanced-interface and strongly polarized CuS/Ti3C2TX composites were successfully synthesized by in-situ etching, sacrificial template and freeze-drying techniques. Its EMW absorption performance was improved by optimizing the hybridization ratio and loading content. The maximum reflection loss of CuS@Ti3C2TX (mass ratio = 5:5) is −54.6 dB and the maximum EAB covering the major of Ku band is 4.72 GHz due to the interface polarization, multiple scattering and dipole polarization. In addition, the electromagnetic interference shielding performance of CuS@Ti3C2TX (mass ratio = 3:7) is up to 23.9 dB. A new heterodimensional structure was developed by the spherical structure and lamellar, which realizes the broadband EMW absorption and electromagnetic protection.

Translated title of the contribution用于微波吸收和电磁干扰屏蔽的具有增强界面损耗的异维结构
Original languageEnglish
Pages (from-to)4021-4030
Number of pages10
JournalScience China Materials
Volume67
Issue number12
DOIs
Publication statusPublished - Dec 2024

Keywords

  • CuS/TiCT
  • heterodimensional structure
  • microwave absorption

Fingerprint

Dive into the research topics of 'Heterodimensional structure with enhanced interface loss for microwave absorption and EMI shielding'. Together they form a unique fingerprint.

Cite this