Fabrication of robust electrothermal MEMS devices using aluminum-tungsten bimorphs and polyimide thermal isolation

Engineering

• Active Layer 50%
• Actuation 50%
• Coefficient of Thermal Expansion 50%
• Low Power Consumption 50%
• Micro Machining 50%
• Microelectromechanical System 100%
• Micromirrors 50%
• One Dimensional 50%
• Proof Mass 100%
• Resistive 50%
• Silicon on Insulator 50%
• Test Result 50%
• Thin Layer 50%
• Transducer 50%

Material Science

• Aluminum 100%
• Film 20%
• Microelectromechanical System 100%
• Micromachining 20%
• Polyimide 100%
• Silicon on Insulator 20%
• Thermal Expansion 20%
• Transducer 20%
• Tungsten 100%