TY - GEN
T1 - Effects of particle size on microstructures and properties of Si/Al composites
AU - Zhai, Wei Chen
AU - Zhang, Zhao Hui
AU - Wang, Fu Chi
AU - Li, Shu Kui
PY - 2014
Y1 - 2014
N2 - Si/Al composites with different Si particle sizes were fabricated using spark plasma sintering process for electronic packaging. The density, thermal conductivity, coefficient of thermal expansion and flexural strength of the composites were investigated. Effect of Si particle size on structure and properties of the Si/Al composites were studied. The results showed that the Si/Al composites synthesized by spark plasma sintering were composed of Si and Al. Al was uniformly distributed among the Si phase, leading to a high thermal conductivity (>120 W/m·k). The relative density of the Si/Al composites decreased with increasing Si particle size. Small Si particle size produced small grains, leading to a low coefficient of thermal expansion and a high strength. There is an optimal matching among the thermal conductivity, coefficient of thermal expansion and flexural strength when the Si particle size was 44 um.
AB - Si/Al composites with different Si particle sizes were fabricated using spark plasma sintering process for electronic packaging. The density, thermal conductivity, coefficient of thermal expansion and flexural strength of the composites were investigated. Effect of Si particle size on structure and properties of the Si/Al composites were studied. The results showed that the Si/Al composites synthesized by spark plasma sintering were composed of Si and Al. Al was uniformly distributed among the Si phase, leading to a high thermal conductivity (>120 W/m·k). The relative density of the Si/Al composites decreased with increasing Si particle size. Small Si particle size produced small grains, leading to a low coefficient of thermal expansion and a high strength. There is an optimal matching among the thermal conductivity, coefficient of thermal expansion and flexural strength when the Si particle size was 44 um.
KW - Coefficient of thermal expansion
KW - Flexural strength
KW - Si/Al composites
KW - Spark plasma sintering
KW - Thermal conductivity
UR - http://www.scopus.com/inward/record.url?scp=84891928654&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.873.361
DO - 10.4028/www.scientific.net/AMR.873.361
M3 - Conference contribution
AN - SCOPUS:84891928654
SN - 9783037859698
T3 - Advanced Materials Research
SP - 361
EP - 365
BT - 8th China National Conference on Functional Materials and Applications
T2 - 8th China National Conference on Functional Materials and Applications, NCFMA 2013
Y2 - 23 August 2013 through 26 August 2013
ER -