Abstract
—We lead the lightly doped drain (LDD) structure into the bridged-grain (BG) poly-Si thin film transistor (TFT). This combined structure can restrain the gate induced drain leakage current (GIDL) and the electrical characteristics shows not much sacrifice. A high Ion/Ioff current ratio 3.79×108 is achieved. Besides, the device reliability is improved significantly. Because the lateral electrical field decreases by LDD, lower trap state density is generated in the SiO2/poly-Si interface and the grain boundaries of poly-Si near the surface conduction channel, resulting in the stable on-state drive current (Ion) and drain saturation voltage (Vdsat). All test results indicate that the BG poly-Si TFT with a LDD structure will work well and has a great potential for system-on-panel application.
Original language | English |
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Pages (from-to) | 766-770 |
Number of pages | 5 |
Journal | Digest of Technical Papers - SID International Symposium |
Volume | 50 |
Issue number | S1 |
DOIs | |
Publication status | Published - 2019 |
Event | International Conference on Display Technology, ICDT 2019 - Suzhou, China Duration: 26 Mar 2019 → 29 Mar 2019 |
Keywords
- Bridged-grain (BG)
- Hot-carrier effect (HC effect)
- Index Terms—low-temperature polycrystalline silicon thin film transistors (LTPS-TFTs)
- Lightly doped drain (LDD)
- Reliability