Effect of SiO2 nano-particles on adhesion strength of copper conductive adhesives

Tong Xiang Liang; Wen You Ma; Mao Sheng Cao

Effect of SiO₂ nano-particles on adhesion strength of copper conductive adhesives

Tong Xiang Liang^*, Wen You Ma, Mao Sheng Cao

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO₂ nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145°C for 2 h. The adhesion strength increased to 25 MPa when the SiO₂ nano-particles were doped. This result is attributed to the fact that SiO₂ nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.

Original language	English
Pages (from-to)	225-228
Number of pages	4
Journal	Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
Volume	21
Issue number	1
Publication status	Published - Jan 2005
Externally published	Yes

Keywords

Adhesion strength
Conductive adhesive
Nano-particles

Cite this

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title = "Effect of SiO2 nano-particles on adhesion strength of copper conductive adhesives",

abstract = "Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO2 nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145°C for 2 h. The adhesion strength increased to 25 MPa when the SiO2 nano-particles were doped. This result is attributed to the fact that SiO2 nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.",

keywords = "Adhesion strength, Conductive adhesive, Nano-particles",

author = "Liang, {Tong Xiang} and Ma, {Wen You} and Cao, {Mao Sheng}",

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T1 - Effect of SiO2 nano-particles on adhesion strength of copper conductive adhesives

AU - Liang, Tong Xiang

AU - Ma, Wen You

AU - Cao, Mao Sheng

PY - 2005/1

Y1 - 2005/1

N2 - Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO2 nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145°C for 2 h. The adhesion strength increased to 25 MPa when the SiO2 nano-particles were doped. This result is attributed to the fact that SiO2 nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.

AB - Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO2 nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145°C for 2 h. The adhesion strength increased to 25 MPa when the SiO2 nano-particles were doped. This result is attributed to the fact that SiO2 nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.

KW - Adhesion strength

KW - Conductive adhesive

KW - Nano-particles

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SN - 1000-7555

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JO - Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering

JF - Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering

IS - 1

ER -

Effect of SiO₂ nano-particles on adhesion strength of copper conductive adhesives

Abstract

Keywords

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