Effect of interfacial angles on stress wave propagation in SiC/Al layered composite materials

Rui Yang, Zhao Hui Zhang*, Ming Yan Sun, Fu Chi Wang, Lu Wang, Shu Kui Li

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The effect of interfacial angles on stress wave propagation and attenuation in SiC/Al layered composite materials was studied by applying the finite element method (FEM). The simulation results show that the attenuation coefficient of stress wave in SiC/Al composite decreases with an increase in taper angles of the contact surface as the stress wave propagates from SiC ceramic to Al alloy, indicating that the attenuation coefficient of stress wave has a negative relationship with taper angles. However, the attenuation coefficient of stress wave increases with taper angles increasing when the stress wave propagates from Al alloy to SiC ceramic. In addition, no obvious change is observered for the attenuation coefficient of stress wave as the taper angle exceeds 210°.

Original languageEnglish
Pages (from-to)101-105
Number of pages5
JournalDongbei Daxue Xuebao/Journal of Northeastern University
Volume33
Issue numberSUPPL.1
Publication statusPublished - Jun 2012

Keywords

  • Interface taper angle
  • Numerical simulation
  • SiC/Al layered composite material
  • Stress wave attenuation

Fingerprint

Dive into the research topics of 'Effect of interfacial angles on stress wave propagation in SiC/Al layered composite materials'. Together they form a unique fingerprint.

Cite this