Abstract
In this work, a two layered mini/micro-channel heat sink based on liquid metal and water is proposed. The mini channel for liquid metal and micro channel for water were stacked together to enhance the cooling capability. The thermal performance of current design is analyzed using the three dimensional numerical simulation. The effects of different flow arrangements and heating direction on the thermal performance of the heat sink are studied under different flow rates. The results indicate that the thermal resistance and streamwise temperature rise of the counter flow arrangement with water channel layer attaching the heat source are substantially reduced. In addition, the two layered heat sink based on liquid metal and water has better heat dissipation capacity for its relatively lower thermal resistance and pumping power than the pure liquid metal and water two-layered heat sink.
| Original language | English |
|---|---|
| Pages (from-to) | 3655-3661 |
| Number of pages | 7 |
| Journal | International Heat Transfer Conference |
| Volume | 2018-August |
| DOIs | |
| Publication status | Published - 2018 |
| Externally published | Yes |
| Event | 16th International Heat Transfer Conference, IHTC 2018 - Beijing, China Duration: 10 Aug 2018 → 15 Aug 2018 |
Keywords
- Electronic equipment cooling
- Heat sink
- Heat transfer enhancement
- Liquid metal
- Micro/mini-channel
- Numerical simulation