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Adhesion strength, stability and electronic properties of TiB2 reinforced copper matrix composites: A first principles study
Yao Shu*, Yongnan Xiong, Xing Luo, Zhibo Zhang, Jiazhen He, Cuicui Yin, Xiaoyong Ding, Shaowen Zhang*, Kaihong Zheng*
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
3
Citations
(Scopus)