A two-dimensional ultrasonically assisted grinding technique for high efficiency machining of sapphire substrate

Z. Liang*, Y. Wu, X. Wang, Y. Peng, W. Xu, W. Zhao

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

11 Citations (Scopus)

Fingerprint

Dive into the research topics of 'A two-dimensional ultrasonically assisted grinding technique for high efficiency machining of sapphire substrate'. Together they form a unique fingerprint.

Engineering