A study on the grain orientation and grain boundary of electroformed copper

Li Ya Guan*, Xiu Hua Zheng, Fu Chi Wang, Shu Kui Li

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'A study on the grain orientation and grain boundary of electroformed copper'. Together they form a unique fingerprint.

Engineering

Material Science