Abstract
The transmission characteristics of in-plane impact load of flying debris at the typical interfaces in a encapsulated circuit system are studied to improve the impact resistance of missile-borne circuit system. The transfer process of impact load at epoxy resin/PCB/epoxy resin interfaces is analyzed from the perspective of experiment, theory and simulation.The variation processes of impact load at the interfaces are measured using the multiple embedded stress sensors.Depending on the theory of stress wave propagation, the incident, reflective and transmission characteristics of shock wave at those interfaces are analyzed, and the attenuation characteristics of shock wave in the viscous medium are considered. The approximate theoretical results of transmission of impact load at the interfaces were obtained through calculation.The experimental results were verified by numerical simulation, combined with the results in Ref.[16]. The theoretical and simulated results agreed well with the measured data.The results show that the overload at the back of PCB is smaller along the direction of stress wave propagation.
| Translated title of the contribution | Transmission Characteristics of Impact Load of Flying Debris at Epoxy Resin/printed Circuit Board/epoxy Resin Interfaces |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 1817-1825 |
| Number of pages | 9 |
| Journal | Binggong Xuebao/Acta Armamentarii |
| Volume | 41 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - Sept 2020 |