硅基微波毫米波收发芯片封装结构研究

Translated title of the contribution: Research on Packaging Structure of Silicon-based Microwave and Millimeter Wave Transceiver Chip

Haochen Liang*, Feng Qian, Hongchang Shen, Yang Xu

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

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