用于5G高频/高速覆铜板的苯并口恶嗪改性进展

Translated title of the contribution: Modification Progress of Benzoxazine Resin-Based Copper Cad Laminate for 5G

Dandan Chen, Benben Liu, Xingyan Xu, Xiangmei Li*, Rongjie Yang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The requirements of 5G communication on the dielectric properties, thermal properties and flame retardancy of copper clad laminates were reviewed. The advantages and disadvantages of the resin matrix for high frequency/high speed copper clad laminates were compared. The research progress of benzoxazine used in copper clad laminate was mainly introduced. Benzoxazine has excellent heat resistance and flame retardancy, excellent dimensional stability, low dielectric constant and dielectric loss, and was widely used in electronic components. Modification of molecular design and nanomaterials or copolymerization can further improve its dielectric properties, thermal properties and flame retardancy, thus can be used as high-performance resin matrix or adhesive in rigid copper clad laminate and flexible copper clad laminate, respectively. Finally, according to the market demands of high frequency/high speed copper clad laminates, the applications of benzoxazine resin were prospected.

Translated title of the contributionModification Progress of Benzoxazine Resin-Based Copper Cad Laminate for 5G
Original languageChinese (Traditional)
Pages (from-to)173-184
Number of pages12
JournalGaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
Volume37
Issue number11
DOIs
Publication statusPublished - Nov 2021

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