Calculated based on number of publications stored in Pure and citations from Scopus
20142023

Research activity per year

Network

Qiaoqiang Gan

  • University at Buffalo
  • SUNY Buffalo
  • King Abdullah University of Science and Technology
  • University of Shanghai for Science and Technology

External person

Haomin Song

  • University at Buffalo
  • SUNY Buffalo
  • King Abdullah University of Science and Technology
  • Fudan University

External person

Dengxin Ji

  • University at Buffalo
  • SUNY Buffalo

External person

Xie Zeng

  • University at Buffalo
  • Fudan University
  • SUNY Buffalo
  • King Abdullah University of Science and Technology

External person

Kai Liu

  • University at Buffalo

External person

Suhua Jiang

  • Fudan University
  • University at Buffalo

External person

Alec R. Cheney

  • University at Buffalo

External person

Lyu Zhou

  • University at Buffalo
  • SUNY Buffalo
  • King Abdullah University of Science and Technology

External person

Matthew H. Singer

  • University at Buffalo
  • SUNY Buffalo
  • King Abdullah University of Science and Technology

External person

Haifeng Hu

  • Northeastern University China
  • University at Buffalo
  • University of Shanghai for Science and Technology

External person

Borui Chen

  • University at Buffalo

External person

Zongfu Yu

  • Department of Civil and Environmental Engineering, University of Wisconsin-Madison
  • University at Buffalo
  • University of Wisconsin-Madison

External person

Youhai Liu

  • University at Buffalo
  • SUNY Buffalo

External person

Zhejun Liu

  • University at Buffalo
  • Fudan University

External person

Jun Gao

  • Fudan University
  • University at Buffalo

External person

Yun Xu

  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Beijing Key Laboratory of Inorganic Stretchable and Flexible Information Technology
  • Chinese Academy of Sciences

External person

Alexander N. Cartwright

  • University at Buffalo

External person

Boon S. Ooi

  • King Abdullah University of Science and Technology

External person

Yongkang Gao

  • Nokia
  • Lehigh University

External person

Chenyu Li

  • University at Buffalo

External person

Zongmin Bei

  • University at Buffalo
  • SUNY Buffalo

External person

Yun Wu

  • Department of Biomedical Engineering
  • University at Buffalo
  • King Abdullah University of Science and Technology

External person

Josep Miquel Jornet

  • University at Buffalo
  • Department of Mechanical and Industrial Engineering, Northeastern University
  • King Abdullah University of Science and Technology

External person

Luqing Guo

  • Fudan University

External person

Jacob Rada

  • University at Buffalo
  • King Abdullah University of Science and Technology

External person

Chi Zhou

  • University at Buffalo

External person

Diana Aga

  • SUNY Buffalo

External person

Xiang Liu

  • Fudan University

External person

Tim Thomay

  • University at Buffalo

External person

Yizheng Li

  • University at Buffalo
  • King Abdullah University of Science and Technology

External person

Edgars Stegenburgs

  • King Abdullah University of Science and Technology

External person

Jianwei Liang

  • King Abdullah University of Science and Technology

External person

Kuang Hui Li

  • King Abdullah University of Science and Technology

External person

Yun Song

  • Fudan University

External person

Yunchen Yang

  • Department of Biomedical Engineering
  • University at Buffalo

External person

Guofeng Song

  • Beijing Key Laboratory of Inorganic Stretchable and Flexible Information Technology
  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Lorraine Collins

  • SUNY Buffalo

External person

Jiyuan Duan

  • Entry-Exit Inspection and Quarantine Bureau
  • Technical Center for Industrial Product and Raw Material Inspection and Testing

External person

Ming Zhou

  • Department of Civil and Environmental Engineering, University of Wisconsin-Madison

External person

Chang Chieh Hsu

  • University at Buffalo
  • Department of Biomedical Engineering
  • King Abdullah University of Science and Technology

External person

Haoming Song

  • University at Buffalo

External person

Tong Li

  • Chinese Academy of Sciences
  • General Hospital of People's Liberation Army
  • Hong Kong Polytechnic University
  • City University of Hong Kong

External person

Huamin Chen

  • Minjiang University
  • Chinese Academy of Sciences
  • University of Chinese Academy of Sciences

External person

Filbert Bartoli

  • Lehigh University

External person

Yingkun Zhu

  • University at Buffalo

External person

Ziheng Ji

  • Peking University

External person

Dalin Sun

  • Fudan University

External person

Lin Bai

  • Chinese Academy of Sciences

External person

Dylan Tua

  • University at Buffalo

External person

Kebin Shi

  • Peking University
  • Shanxi University
  • Collaborative Innovation Center of Quantum Matter

External person

Chen Zhao

  • Chinese Academy of Sciences

External person

John D. Atkinson

  • University at Buffalo

External person

Jiushuang Zhang

  • Chinese Academy of Sciences

External person

Feng Zhang

  • University at Buffalo

External person

Tien Khee Ng

  • King Abdullah University of Science and Technology

External person

Wei Li

  • Texas Tech University
  • Texas Tech University

External person

Shaohua Pi

  • University at Buffalo
  • Fudan University

External person

Ziye Dong

  • Texas Tech University
  • Texas Tech University

External person

Matthew Signer

  • University at Buffalo

External person

Xiaodong Gu

  • Fudan University

External person

Feng Yang

  • University at Buffalo

External person

Tianmu Zhang

  • University at Buffalo

External person

Wenhong Yang

  • King Abdullah University of Science and Technology

External person

Yinggui Wang

  • Wuhan Institute of Technology

External person

Tong Li

  • Beijing Key Laboratory of Inorganic Stretchable and Flexible Information Technology
  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Huafan Zhang

  • King Abdullah University of Science and Technology

External person

Shumin Xiao

  • Harbin Institute of Technology
  • Shanxi University

External person

Xin Wei

  • Beijing Key Laboratory of Inorganic Stretchable and Flexible Information Technology
  • CAS - Institute of Semiconductors
  • University of Chinese Academy of Sciences

External person

Hailong Yu

  • Chinese Academy of Sciences

External person

Yuesheng Li

  • Fudan University

External person

Zhancheng Li

  • Nankai University

External person

Thomas D. Anthopoulos

  • King Abdullah University of Science and Technology

External person

Chen Xu

  • Beijing Institute of Technology
  • Hangzhou Dianzi University

External person

Shuqi Chen

  • Shanxi University
  • Nankai University

External person

Jiangyu Wu

  • Wuhan Institute of Technology

External person

Tien Khee Ng

  • King Abdullah University of Science and Technology

External person

Yu Jiang

  • Chinese Academy of Sciences

External person

Yaowu Hu

  • University at Buffalo

External person

Zhi Sun

  • University at Buffalo

External person

Ayrton Bernussi

  • Texas Tech University

External person

Chu Wang

  • University at Buffalo

External person

Enzo M. Di Fabrizio

  • King Abdullah University of Science and Technology
  • Magna Græcia University

External person

Tania Moein

  • University at Buffalo

External person